1 aos semiconductor product reliability report AOWF11C60 , rev a plastic encapsulated device alpha & omega semiconductor, inc www.aosmd.com
2 this aos product reliability report summarizes the qualification result for AOWF11C60 . accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. review of final electrical test result confir ms that AOWF11C60 passes aos quality and reliability requirements. the released product will be categorized by the process family and be routine monitored for continuously improving the product quality. table of contents: i. product description ii. package and die information iii. reliability stress test summary and result s iv. reliability evaluation i. product description: ? latest trench power alphamos - ii technology ? low r ds(on) ? low ciss and crss ? high current capability ? rohs and halogen free compliant ? general lighting for led and ccfl ? ac/dc power supplies for industrial, consumer, and telecom details refer to the datasheet. ii. die / package information: AOWF11C60 process standard sub - micron 6 0 0 v n - channel mos fet package type to262f lead frame bare cu die attach s o ft solder bond a l wire mold material epoxy resin with silica filler moisture level up to level 1
3 iii. reliability stress test summary and resul ts * note : the reliability data presents total of available generic data up to the published date. iv. reliability evaluation fit rate (per billion): 3.05 mt t f = 3 7419 years the presentation of fit rate for the individual product reliability is restricted by the actual burn - in sampl e size . failure rate determination is based on jedec standard jesd 85. fit means one failure per billion hours. failure rate = chi 2 x 10 9 / [ 2 (n) (h) (af) ] = 3. 05 mt t f = 10 9 / fit = 37419 years chi2 = chi squared distribution, determined by the number of failures and confidence interval n = total nu mber of units from burn - in tests h = duration of burn - in testing af = acceleration factor from test to use conditions (ea = 0.7ev and tuse = 55 c ) acceleration factor [ af ] = exp [ea / k (1/tj u C 1/tj s )] acceleration factor ratio list: 55 deg c 70 deg c 85 deg c 100 deg c 115 deg c 130 deg c 150 deg c af 25 9 87 32 13 5.64 2.59 1 tj s = stressed junction temperature in degree (kelvin), k = c+273.16 tj u =the use junction temperature in degree (kelvin), k = c+273.16 k = boltz m anns constant, 8.6 17164 x 10 - 5 e v / k test item test condition time point total sample s ize * number of failures reference standard msl precondition 168hr 85 c / 85%rh + 3 cycle reflow@260 c (msl 1) - 4389 pcs 0 jesd22 - a113 htgb temp = 150 c , vgs=100% of vgsmax 168 / 500 / 1000 h ou rs 924 pcs 0 jesd22 - a108 htrb temp = 150 c , vds=80% of vdsmax 168 / 500 / 1000 h ou rs 924 pcs 0 jesd22 - a108 hast 130 c , 85% rh , 33.3 psi, v d s = 8 0% of v d s max up to 42v 96 h ou rs 924 pcs 0 jesd22 - a110 h3 trb 85 c , 85% rh , v d s = 8 0% of v d smax up to 100v 1000 h ou rs 693 pcs 0 jesd22 - a101 autoclave 121 c , 29.7psi , rh=100% 96 h ou rs 924 pcs 0 jesd22 - a102 temperature cycle - 65 c to 150 c , air to air, 250 / 500 cycles 924 pcs 0 jesd22 - a104 power cycling ?? tj = 1 00 c 8572 cycles 924 pcs 0 aec q101
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